NY3170HC/NY3170HCP
Tg180℃ Halogen-free and Lead-free Compatible
VeryLow Z-axis CTE
Excellent Dimension Stability
Excellent Anti-CAF Performance
Excellent Tracking Resistance CTI≥600V(IEC60112 Method)
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Automotive -
Power Board for Heavy Copper -
Instrumentartions
Typical Properties for NY3170HC Laminate
| Property | Item | IPC-TM-650 | Test Condition | Unit | Typical Value | |
| Thermal | Glass Transition Temperature | 2.4.25 | DSC | ℃ | 180 | |
| 2.4.24 | TMA | ℃ | 170 | |||
| 2.4.24.4 | DMA | ℃ | 205 | |||
| X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | ppm/°C | 13\14 | ||
| Z-axis CTE | 2.4.24 | ＜Tg,TMA | ppm/°C | 40 | ||
| ＞Tg,TMA | ppm/°C | 210 | ||||
| 2.4.24 | 50~260℃ | % | 2.3 | |||
| Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 380 | ||
| Thermal Resistance | 2.4.24.1 | Clad | Min | ＞60 | ||
| Etched | Min | ＞60 | ||||
| Electrical | Dk (R/C:55%/70%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | 4.10\3.90 |
| 1GHz | 4.05\3.85 | |||||
| 10GHz | SPDR method | \ | ||||
| Df (R/C:55%/70%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | 0.0111\0.0128 | |
| 1GHz | — | 0.0125\0.0135 | ||||
| 10GHz | SPDR method | \ | ||||
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 1.8×1010 | ||
| Surface Resistivity | MΩ | 1.1×109 | ||||
| Physical | Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 0.8 | |
| Peel Strength | 1oz | \ | ||||
| Peel Strength | 1oz | \ | ||||
| Flexural Strength | Warp | 2.4.4 | As Received | N/mm² | 550 | |
| Fill | 450 | |||||
| Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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