NY3170HF/NY3170HFP
High Performance Halogen-free and Lead-free Compatible
Low Z-axis CTE
Excellent Anti-CAF Performance
Excellent Dimension Stability
-
Tablet -
Notebook -
HDD/SSD -
Smart Phone -
Memory Module -
Wearable Device
Typical Properties for NY3170HF Laminate
| 属性 Property | 项目 Item | 测试方法 IPC-TM-650 | 测试条件 Test Condition | 单位 Unit | 典型值 Typical Value | |
| 热性能 Thermal | 玻璃态转换温度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | 190 | |
| 2.4.24 | TMA | ℃ | / | |||
| 2.4.24.4 | DMA | ℃ | / | |||
| Z轴热膨胀系数 Z-axis CTE | 2.4.24 | ＜Tg,TMA | ppm/°C | 38 | ||
| ＞Tg,TMA | ppm/°C | 185 | ||||
| 2.4.24 | 50~260℃ | % | 2.0 | |||
| 热分解温度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 385 | ||
| 耐热性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞60 | ||
| Etched | Min | ＞60 | ||||
| 电性能 Electrical | 介电常数 Dk (R/C:55%/70%) Permittivity | 1GHz | 2.5.5.9 | C-24/23/50 | — | 3.9\3.6 |
| 10GHz | SPDR method | — | 3.7\3.4 | |||
| 介质损耗 Df (R/C:55%/70%) Loss Tangent | 1GHz | 2.5.5.9 | C-24/23/50 | — | 0.0084\0.0091 | |
| — | ||||||
| 10GHz | SPDR method | 0.0095\0.0104 | ||||
| 体积电阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 1.0×1010 | ||
| 表面电阻 Surface Resistivity | MΩ | 1.0×1010 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| 剥离强度 (HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 0.9 | |
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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