NY8320NSA/NY8320NSAP
High Tg, Low CTE and High modulus
Excellent heat resitance and Anti-CAF Performance
Superior PTH reliability and easy PCB processing
Halogen-Free
-
Application processer -
Finger print -
Camera Module -
Wi-Fi Module -
SD/TF Card
Typical Properties for NY8320 NSA Laminate
| Property | Item | IPC-TM-650 | Test Condition | Unit | Typical Value | |
| Thermal | Glass Transition Temperature | 2.4.25 | DSC | ℃ | \ | |
| 2.4.24 | TMA | ℃ | 210~230 | |||
| 2.4.24.4 | DMA | ℃ | 250~280 | |||
| （1078×2） X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | ppm/°C | 13 | ||
| （2116×8） Z-axis CTE | 2.4.24 | ＜Tg,TMA | ppm/°C | 30 | ||
| ＞Tg,TMA | ppm/°C | 90 | ||||
| 2.4.24 | 50~260℃ | % | 1.1~1.3 | |||
| Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 420 | ||
| T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞60 | ||
| Etched | Min | ＞60 | ||||
| Electrical | (R/C:50%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ |
| 1GHz | 4.3 | |||||
| 10GHz | SPDR method | 4.2 | ||||
| (R/C:50%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ | |
| 1GHz | — | 0.006 | ||||
| 10GHz | SPDR method | 0.007 | ||||
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 1.0×109 | ||
| Surface Resistivity | MΩ | 1.0×108 | ||||
| Physical | Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
(HTE) Peel Strength | Toz | 2.4.8 | As Received | N/mm | \ | |
(RTF) Peel Strength | Toz | \ | ||||
(VLP) Peel Strength | Toz | 0.7 | ||||
| Flexural Modulus | GB / T 9341-2018 | @RT | Gpa | 22\23 | ||
| Young's Modulus | GB / T 1040.1-2018 | @RT | Gpa | 22\23 | ||
| Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
Ready to drive innovation for your success?
We are committed to harnessing the immense power of technological innovation to provide global customers with efficient, sustainable full-range CCL solutions.
