NY6600
Low Dk (Dk 3.90@3.5GHz，Ring Resonator)
Low Df (Df 0.004@10GHz)
Tg >200℃ and high thermostability
Superior PTH reliability and easy PCB processing
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Carrier plate power amplifier
NY6600 Specification Sheet for Laminate
| NY6600ANT Laminate | Test Method | Test Condition | Units | Typical Value |
| IPC-TM-650 | Metric(English) | 1.524mm CCL | ||
| Tg Glass Transition Temperature | 2.4.24.4 | DMA | ℃ | 240 |
| 2.4.24 | TMA | ℃ | 220 | |
| Z-axis CTE A. 50 to 260 ℃ | 2.4.24 | TMA | % | 0.95 |
| X/Y-axis CTE A. 50 to 125℃ | 2.4.24 | TMA | ppm/°C | 10/10 |
| Td Decomposition Temperature | TD (5% wt loss) | — | ℃ | 410 |
| Thermal Resistance (Copper removed) A.T288 B.T300 | 2.4.24.1 | TMA | Minutes Minutes | > 60 > 60 |
| Dk Permittivity | Ring Resonator | 3.5 GHz/23℃ | — | 3.90 |
| Df Loss Tangent | SPDR | 10 GHz/23℃ | Maximum | 0.0040 |
| Water Absorption | 2.6.2.1 | — | % Maximum | 0.13 |
| Peel Strength | 2.4.8 | Hoz RTF | N/mm(lb/inch) | 0.6 (3.5) |
| Volume Resistivity | 2.5.17.1 | — | MΩ-cm Minimum | ＞10×1010 |
| Surface Resistivity | 2.5.17.1 | — | MΩ Minimum | ＞10×109 |
| Tensile strength | GB/T 1040.1-2018 | — | MPa | 210/210 |
| Flexural strength | 2.4.4.1B | — | MPa | 400/425 |
| Tensile Modulus | GB/T 1040.1-2018 | — | Gpa | 18/18 |
| Poisson's Ratio | GB/T 1040.1-2018 | — | μb | 0.2/0.2 |
| Flame Resistance ( Laminate & Prepreg as laminated) | UL94 | — | Rating | V-0 |
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