NYHP-7350PA(X)
Low Dk (Dk 3.5@10 GHz )
Low Df (Df 0.0029@10 GHz)
Tg>Tg>200℃, Halogen-free compatible
Superior PTH reliability and easy PCB processing
Low water absorption
-
Power amplifier for PKG/Antenna -
Microwave/Wireless Communication
NYHP-7350 PA(X) Specification Sheet for Laminate
| NYHP-7350 PA(X) Type Laminate | Test Method | Test Condition | Units | Typical Value | |
| IPC-TM-650 | Metric(English) | 1.016mm CCL | |||
| Peel Strength | 2.4.8 | 1oz RTF | N/mm(lb/inch) | ＞0.8 (4.5) | |
| Volume Resistivity | 2.5.17.1 | COND A | MΩ-cm Minimum | 1.0×1010 | |
| Surface Resistivity | 2.5.17.1 | COND A | MΩ-cm Minimum | 5.1×109 | |
| Water Absorption | 2.6.2.1 | — | % Maximum | 0.08 | |
| Dk Permittivity | 2.5.5.5 | 10 GHz/23℃ | — Maximum | 3.5 | |
| Df Loss Tangent | 2.5.5.5 | 10 GHz/23℃ | — Maximum | 0.0029 | |
| TCDK | 2.5.5.5 | -50℃-150℃ | ppm/°C | 48 | |
| Flexural Strength A. Length direction B. Cross direction | 2.4.4 | RT | N/mm2 Minimum | 220 140 | |
| Thermal Stress A. Unetched B. Etched | 2.4.13.1 | 288℃ | 10 sec at 288℃ | Pass Pass | |
| Flame Resistance ( Laminate & Prepreg as laminated) | — | — | Rating | NA | |
| Tg Glass Transition Temperature | 2.4.24 | DMA | ℃ | >190 | |
| Td Decomposition Temperature | TD (5% wt loss) | — | ℃ | 400 | |
| CTE | X/Y-axis CTE (50-125℃) | 2.4.24 | TMA | PPM/℃ | 19/20 |
| Z-axis CTE (50 to 125 ℃) | 2.4.24 | TMA | PPM/℃ | 50 | |
| Z-axis CTE (50 to 260 ℃) | 2.4.24 | TMA | % | 2.40% | |
| Thermal Resistance (Copper removed) A.T260 B.T288 C.T300 | 2.4.24.1 | — | Minutes Minutes Minutes | >120 > 60 > 60 | |
| CAF Resistance | 2.6.25 | AABUS | Pass/Fail | Pass | |
| PIM | 800/1800/2600 MHz | 43dBm | dBc | <-158 | |
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