NYHP-7350 LNB
Low Dk (Dk 3.3@10GHz)
Low Df (Df 0.0031@10GHz)
Tg >200℃Lead-free compatible
Superior PTH reliability and easy PCB processing
Low water absorption
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LNB
NYHP-7350 LNB Specification Sheet for Laminate
| NYHP-7350 LNB Type Laminate | Test Method | Test Condition | Units | Typical Value |
| IPC-TM-650 | Metric(English) | 0.508 mm CCL | ||
| Peel Strength | 2.4.8 | 0.5oz HTE | N/mm(lb/inch) | ＞0.8 (4.57) |
| Volume Resistivity | 2.5.17.1 | COND A | MΩ-cm Minimum | 1.0×1010 |
| Surface Resistivity | 2.5.17.1 | COND A | MΩ-cm Minimum | 5.1×109 |
| Water Absorption | 2.6.2.1 | — | % Maximum | 0.08 |
| Dk Permittivity | 2.5.5.5 | 10 GHz/23℃ | — Maximum | 3.3 |
| Df Loss Tangent | 2.5.5.5 | 10 GHz/23℃ | — Maximum | 0.0031 |
| TCDK | 2.5.5.5 | -50℃-150℃ | ppm/°C | 48 |
| Flexural Strengt A. Length direction B. Cross direction | 2.4.4 | RT | N/mm2 Minimum | 220 140 |
| Thermal Stress A. Unetched B. Etched | 2.4.13.1 | 288℃ | 10 sec at 288℃ | Pass Pass |
| Flame Resistance ( Laminate & Prepreg as laminated) | UL94 | — | Rating | V-0 |
| Tg Glass Transition Temperature | 2.4.24 | DMA | ℃ | >200 |
| Td Decomposition Temperature | TD (5% wt loss) | — | ℃ | 400 |
| Z-axis CTE A. 50 to 280 ℃ | 2.4.24 | — | % | 1.2 |
| Thermal Resistance (Copper removed) A.T260 B.T288 C.T300 | 2.4.24.1 | — | Minutes Minutes Minutes | >120 > 60 > 60 |
| CAF Resistance | 2.6.25 | AABUS | Pass/Fail | Pass |
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