Your privacy is very important for us. When you visit our website, please agree to the use of all cookies. For more information about the processing of personal data, please go to Privacy Policy

NYHP-7350

Low Dk (Dk 3.50@10GHz)
Low Df (Df 0.0029@10GHz)
Lead-free compatible
Superior PTH reliability and easy PCB processing
Low water Absorption

  • 功放.svg
    Power amplifier for PKG/LNB
  • 汽车雷达.svg
    Automotive radar
  • 微波、无线通讯.svg
    Microwave/Wireless communication

NYHP-7350 Specification Sheet for Laminate

NYHP-7350 Type LaminateTest MethodConditionUnitsTypical Value
IPC-TM-650Metric(English)1.524mm CCL
Peel Strength2.4.81oz HTEN/mm(lb/inch)0.8 (4.5)
Volume Resistivity2.5.17.1COND AMΩ-cm
Minimu
1.0×1010
Surface Resistivity2.5.17.1COND AMΩ
Minimum
5.1×109
Water Absorption2.6.2.1%
maximum
0.13
Dk
Permittivity
2.5.5.510 GHz/23℃Maximum3.50 
Df
Loss Tangent
2.5.5.510 GHz/23℃Maximum0.0029 
TCDK2.5.5.5-50℃-150℃ppm/°C 40 
Flexural Strength
A. Length Direction
B. Cross Direction
2.4.4RTN/mm2
Minimum
220
140
Thermal Stress
A. Unetched
B. Etched
2.4.13.1288℃10 sec at 288℃Pass
Pass
Flame Resistance
( Laminate & Prepreg as laminated)
UL94
(UL File: E213990)
RatingV-0
Tg
Glass Transition Temperature
2.4.24DMA190
Td
Decomposition Temperature
TD
(5% wt loss)
400
CTEX/Y-axis CTE
(50-125℃)
2.4.24TMAPPM/℃22/25
Z-axis CTE2.4.24TMAPPM/℃100
Thermal Resistance (Copper Removed)
A.T260
B.T288
C.T300
2.4.24.1Minutes
Minutes
Minutes
>120
> 60
> 60
PIM800/1800/2600
MHz
AABUSdBc<-158
Thermal ConductivityASTM D5470W/m•℃0.60 


Ready to drive innovation for your success?

We are committed to harnessing the immense power of technological innovation to provide global customers with efficient, sustainable full-range CCL solutions.

a_img11.jpg a_imgph07.jpg

Download PDF

  • Verification code *
  • I have read and agree to Privacy Policy.
  • Get it now