NYHP-7300H
Low Dk (Dk 2.98@10GHz)
Low Df (Df 0.0015@10GHz)
Tg >180℃ and high thermostabilit
Superior PTH reliability and easy PCB processing
HVLP copper by default
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High performance Antenna/Base Station
NYHP-7300H Specification Sheet for Laminate
| NYHP-7300H Laminate | Test Method | Condition | Units | Typical Value |
| IPC-TM-650 | Metric(English) | 1.524mm CCL | ||
| Peel Strength | 2.4.8 | 1oz HVLP | N/mm(lb/inch) | ＞0.7 (4.0) |
| Volume Resistivity C-96/35/90 | 2.5.17.1 | COND A | MΩ-cm Minimu | 4×108 |
| Surface Resistivity C-96/35/90 | 2.5.17.1 | COND A | MΩ Minimum | 2.1×108 |
| Water Absorption | 2.6.2.1 | — | % Maximum | 0.14 |
| Dk Permittivity | 谐振环 | 2 GHz/23℃ | Maximum | 2.98 ± 0.05 |
| 2.5.5.5C | 10 GHz/23℃ | Maximum | 2.98 ± 0.05 | |
| Df Loss Tangent | 2.5.5.5C | 10 GHz/23℃ | Maximum | 0.0015 |
| SPDR | 10 GHz/23℃ | Maximum | 0.0014 | |
| TCDK | 2.5.5.5 | -50℃-150℃ | ppm/°C | 40 |
| Flexural Strength A. Length Direction B. Cross Direction | ASTM D790 | RT | N/mm2 Minimum | 210 155 |
| Thermal Stress A. Unetched B. Etched | 2.4.13.1 | 288℃ | 10 sec at 288℃ | Pass Pass |
| Flame Resistance ( Laminate & Prepreg as laminated) | UL94 （UL File: E213990) | — | Rating | V-0 |
| Tg Glass Transition Temperature | 2.4.24 | DMA | ℃ | >180 |
| Td Decomposition Temperature | TD (5% wt loss) | — | ℃ | >380 |
| Z-axis CTE (50-260℃) a1 ( 50 to 100 ℃) a2 ( 200 to 260 ℃) | 2.4.24 | — | % PPM/℃ PPM/℃ | 3.2 50 280 |
| Thermal Resistance (Copper Removed) A.T260 B.T288 C.T300 | 2.4.24.1 | — | Minutes Minutes Minutes | >120 > 60 > 60 |
| CAF Resistance | 2.6.25 | AABUS | Pass/Fail | Pass |
| PIM | 800/1800/2600 MHz | — | dBc | ≤-158 |
NYHP-7300 Sheet Material MSDS
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