NY2150H基板典型性能 Typical Properties for NY2150H Laminate
| 属性 Property | 项目 Item | 测试方法 IPC-TM-650 | 测试条件 Test Condition | 单位 Unit | 典型值 Typical Value | |
| 热性能 Thermal | 玻璃态转换温度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | 175 | |
| 2.4.24 | TMA | ℃ | 165 | |||
| 2.4.24.4 | DMA | ℃ | \ | |||
| X/Y轴热膨胀系数 X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | PPM/℃ | 13\14 | ||
| Z轴热膨胀系数 Z-axis CTE | 2.4.24 | ＜Tg,TMA | PPM/℃ | 30 | ||
| ＞Tg,TMA | PPM/℃ | 240 | ||||
| 2.4.24 | 50~260℃ | % | 2.8 | |||
| 热分解温度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 350 | ||
| 耐热性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | 30 | ||
| Etched | Min | 30 | ||||
| 电性能 Electrical | 介电常数 Dk (R/C:55%/70%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | 4.30\3.90 |
| 1GHz | 4.25\3.85 | |||||
| 10GHz | SPDR method | \ | ||||
| 介质损耗 Df (R/C:55%/70%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | 0.0147\0.0158 | |
| 1GHz | 0.0158\0.0170 | |||||
| 10GHz | SPDR method | \ | ||||
| 体积电阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 6.5×108 | ||
| 表面电阻 Surface Resistivity | MΩ | 3.6×107 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.09 | |
| 剥离强度 (HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 1.4 | |
| 剥离强度(RTF) Peel Strength | 1oz | \ | ||||
| 剥离强度(HVLP) Peel Strength | 1oz | \ | ||||
| 弯曲强度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm2 | 515 | |
| Fill | 405 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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